NEC Creates New Heat-Conducting Bioplastic For Phones
April 9, 2007 – 1:13 pmIf you're new here, you may want to subscribe to our RSS feed. Thanks for visiting Planet Cell Phone!
Mobile phones will soon be shipped that are significantly different that phones of yore.
NEC Corp. has developed a corn-based bioplastic that conducts heat faster than stainless steel, and it aims to mass-produce the material starting in April 2008 for use in mobile phones and other portable devices, the company said on Monday.
The Japanese conglomerate, whose products range from chips to defense systems, said the material could help make laptops and mobile phones thinner and lighter by eliminating the need for heat-releasing sheets or fans.
NEC aims to replace 10 percent of the plastic used in its products with bioplastic by 2010. It began using plastic made from fermented corn and kenaf fiber in its mobile phones in March last year.
Not only safer for the environment, but also technologically better. It doesn’t sound like NEC can go wrong with this product.
If you enjoyed this post, grab the Planet Cell Phone Full RSS feed!
Grab Our Cell Phone RSS Feed
Get Cell Phone Updates via Email
